NXP Semiconductors
PESD24VS1ULD
Unidirectional ESD protection diode
9. Package outline
0.65
0.55
0.4
max
0.30
0.22
2
0.65
1.05
0.95
0.30
0.22
1
0.55
0.45
Dimensions in mm
cathode marking on top side
10-08-06
Fig 11. Package outline PESD24VS1ULD (SOD882D)
10. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
10000
PESD24VS1ULD
SOD882D
2 mm pitch, 8 mm tape and reel
-315
[1]
For further information and the availability of packing methods, see Section 14 .
11. Soldering
1.4
0.2
solder lands
0.8
(2 × )
0.6
(2 × )
0.7
(2 × )
solder resist
solder paste
Dimensions in mm
0.3
0.4
1
1.3
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint PESD24VS1ULD (SOD882D)
sod882d_fr
PESD24VS1ULD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 October 2010
? NXP B.V. 2010. All rights reserved.
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